Google has found critical and commercial success from its Pixel line of smartphones. With the Pixel 8 and Pixel 8 Pro launching next month, what has Google decided can lift the new Pixel phones to new heights?
One of the key upgrades for the two new Pixel smartphones will be the next Tensor Mobile chipset. Designed by Google, the Tensor G1 and Tensor G2 leaned heavily into supporting artificial intelligence and machine learning on the handset by hardcoding many routines into the silicon.
With rumored additions of AI routines to the video editing suite to improve picture quality and remove background noise from the recordings, you can be sure there is a close match between the software and the hardware.
Many will be looking to see if the Pixel 8 and Pixel 8 Pro address one of the ongoing criticisms of the Pixel 7 family, namely the raised operating temperatures of the phones. There will be a correlation between the demand placed on the hardware with higher demand on the Tensor chipset, resulting in higher temperatures.
Part of the solution to addressing it will likely come from using Samsung Foundry’s FO-WLP packaging process during fabrication. Multiple sources are reporting the use of “fan out wafer-level processing” for the Tensor G3. This should reduce heat generation when placed under load and to run more efficiently at other times.
Practically, this should see the Pixel 8 and Pixel 8 Pro run cooler for longer, precisely what you would be looking for in Google’s next smartphone.
Google has previewed the new handsets online and confirmed a full launch event, “Made By Google”, which takes place on October 4th.
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